CMP Polished Cerium Oxide Polishing Powder /K9 Glass

Chemical mechanical polishing (CMP) can not only locally treat the silicon wafer surface, but also flatten the entire silicon wafer surface. It is the only technology that can give consideration to both global and local surface flattening.The traditional planarization technologies for wafer surface treatment include heat flow method, rotating glass method, back etching method, selective deposition, etc., but these can only achieve local planarization and cannot achieve global planarization.​

【Application】

It is suitable for UTG thinning.

【Specification】

1. Chemical properties: TREO>99%, CeO₂/TREO=>99%
2. Color:White
3.PSD: D50=0.6-1.0um,D99<6um

【Product features】
(1) Strong versatility: the product has uniform particle distribution, can meet the requirements of smoothness and abrasion, and has a wide range of applications.
(2) No impurities: multiple screening procedures are adopted to remove impurities to ensure no scratches after use.
(3) Stable suspension: additives are added to keep the product in a good suspension state and easy to clean.


【Application methods】
Recommended specific gravity: 1.03-1.08, depending on the material and process parameters of the glass.
Applicable machine: flat polishing machine or spherical pendulum machine.
Suitable for workpiece: spherical lens with abrasion degree of 80-120, prism, motherboard substrate and other planar optical glass


【Packing】 25kgs/poly-drum ,500kgs/pallet;It can be according to customers requirements.




1 Q: Are you trading company or manufacturer?
A: We are a professional factory with more than 12 years of experience in this field. If you are convenience, we welcome you to visit our company.

2 Q: How can you get sample?
A: Free samples are available, but on the basis that you pay the courier charges.

3 Q: How about the packing?
A:Usually we provide the packing as 50 kg Iron Drum or 25 plastic Drum ,if you have special requirements on them, we will according to you
.
4 Q: What is loading port?
A:Usually is Shanghai


Shanghai Gona Industrial Co.Ltd is founded in 2006, and located in Songjiang Industrial District, rounded by National Engineering research Center of Ultrafine Powder(NERCUP).Our company is a R&D company specialized in technology development of functional powder materials. Focused on the control technology of powder particulate, SHGRENM provide several series product such as rare earth oxide with special particulate properties, cerium oxide polishing powder, catalyst materials,Alumina for Li+ battery separator.

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